Optimized conditions for Ti film electrodeposition were investigated in water-soluble KF-KCl (45:55 mol%) molten salt at 923 K. K3TiF6 was prepared in the melt via a comproportionation reaction between K2TiF6 and Ti sponges. The K3TiF6 solubility was determined to be 1.48 mol%. Galvanostatic electrolysis was conducted on Ni plate substrates at various K3TiF6 concentrations (0.28, 0.70, and 1.43 mol%) and current densities (25-150 mA cm(-2)). Surface and cross-sectional scanning electron microscopy observations showed that adherent, compact, and smooth Ti films were obtained at higher K3TiF6 concentrations and lower current densities. A corrosion test was conducted for the Ti-coated Ni plate using linear sweep voltammetry, which showed that the Ti films have no cracks or voids. (C) The Author(s) 2019. Published by ECS.