A new parameter, the uniformity coefficient (UC), was proposed to overcome the difficulty in quantitatively characterizing the uniformity of the pyramidal textured surface of silicon wafers widely used for monocrystalline silicon cells (MSCs). The UC was defined based on the areal material ratio Smr(c) from the standard ISO 25178-2. First, the values of Smr(c) for MSC wafer surfaces with a uniform texture and an arbitrary texture were calculated. For the ideal uniform texture, Smr(c) was calculated using one pyramid assuming equal pyramids distributed over the wafer surface. For any arbitrary texture, based on the pyramidal geometrical structure, Smr(c) was calculated from the heights of pyramids extracted from their 2D projections. Second, the areas bounded by the Smr(c) curves with two coordinate axes were calculated accordingly. Then, the ratio of the two areas was defined as the UC. Fifteen kinds of monocrystalline silicon wafers were prepared by chemical texturing for 5 min, 15 min, 25 min, 35 min and 45 min with three groups of solutions, and the corresponding MSCs were fabricated. The UCs of the fifteen silicon wafers and the photovoltaic conversion efficiencies (PCEs) of the MSCs were tested. The relationships between the UC, texturing process (solution and time) and PCE were analyzed. The PCE increased monotonically with an increase in the UCs The silicon wafer obtained by texturing with 2% TMAH solution for 25 min had a textured surface with a maximum UC of 0.89, and the MSC exhibited a maximum PCE of 20.3%. The experimental results indicated that the UC is an effective parameter for the quantitative characterization of the pyramidal texture of silicon wafer surfaces and has a definite relationship with the PCE of the MSC. The UC is a useful and convenient measure for texturing process optimization.