Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method

Kwansoo Yang; Yi Young Kang; Hyun Jeong Ahn; Dong-Gyun Kim; No Kyun Park; Siyoung Q. Choi; Jong Chan Won; Yun Ho Kim

Journal of Industrial and Engineering Chemistry, Vol.82, 173-179, February, 2020

DOI10.1016/j.jiec.2019.10.010 Export Citation

Porous boron nitride/polyimide composite films with high thermal diffusivity and low dielectric properties via high internal phase Pickering emulsion method

Kwansoo Yang^{1, 2}, Yi Young Kang¹, Hyun Jeong Ahn^{1, 2}, Dong-Gyun Kim^{1, 2}, No Kyun Park¹, Siyoung Q. Choi³, Jong Chan Won^{1, 2, †}, and Yun Ho Kim^{1, 2, †}

¹Advanced Materials Division, KRICT, Daejeon 34114, Republic of Korea
²KRICT School, University of Science and Technology, Daejeon 34114, Republic of Korea
³Department of Chemical and Biomolecular Engineering, KAIST, Daejeon 34141, Republic of Korea

E-mail:,

Thiswork offers a simple fabrication ofporousboron-nitride-(BN)/polyimide-(PI) composite films withhigh thermal diffusivities and low dielectric constants by combining high-internal-phase Pickering emulsification (HIPPE) and subsequent hot-pressing. BN nanoparticles in composite foams were well dispersed and three-dimensionally connected following the surface of the PI skeleton used as the polymer matrix. The BN contents in the BN/PI composite foams were adjusted in the range of 20-80 wt%. The porosities of the composite films were controlled according to the hot-pressing conditions such as the temperature. The porous BN/PI composite films exhibited high thermal diffusivities of 0.059-1.033 mm2/s and low dielectric constants of 2.08-3.48 at 1 GHz for BN contents of 20-80 wt%. In particular, the BN/PI composite films had extremely low dielectric loss values, close to zero (<0.002) at high frequencies regardless of the BN content and pressing conditions.

Keywords:High-internal-phase Pickering emulsion;Polymer composite;High thermal diffusivity;Low dielectric constant

[References]

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[Referenced By]

[1] Moore AL, Shi L, Mater. Today, 17, 163 (2014)

[2] Huang C, Qian X, Yang R, Mater. Sci. Eng. R-Rep., 132, 1 (2018)

[3] Chen H, Ginzburg VV, Yang J, Yang Y, Liu W, Huang Y, Du L, Chen B, Prog. Polym. Sci, 59, 41 (2016)

[4] Yu C, Gong W, Tian W, Zhang Q, Xu Y, Lin Z, Hu M, Fan X, Yao Y, Compos. Sci. Technol., 160, 199 (2018)

[5] Im H, Kim J, Carbon, 50, 5429 (2012)

[6] Park JS, An YJ, Shin K, Han JH, Lee CS, RSC Adv., 5, 46989 (2015)

[7] Yao Y, Zeng X, Guo K, Sun R, Xu JB, Compos. A: Appl. Sci. Manuf., 69, 49 (2015)

[8] Yorifuji D, Ando S, J. Mater. Chem., 21, 4402 (2011)

[9] Madelung O, Rossler U, Schulz M, Semiconductors-lattice Properties, Springer, 2001.

[10] Yang N, Xu C, Hou J, Yao Y, Zhang Q, Grami ME, He L, Wang N, Qu X, RSC Adv., 6, 18279 (2016)

[11] Li TL, Hsu SLC, J. Phys. Chem. B, 114(20), 6825 (2010)

[12] Shen X, Wang ZY, Wu Y, Liu X, Kim JK, Carbon, 108, 412 (2016)

[13] Hou J, Li G, Yang N, Qin L, Grami ME, Zhang Q, Wang N, Qu X, RSC Adv., 4, 44282 (2016)

[14] Fu C, Li Q, Lu J, Mateti S, Cai Q, Zeng X, Du G, Sun R, Chen Y, Xu J, Wong CP, Compos. Sci. Technol., 165, 322 (2018)

[15] Feng Y, He C, Wen Y, Zhou X, Xie X, Ye Y, Mai YW, Compos. Sci. Technol., 160, 42 (2018)

[16] Zhou Y, Liu F, Wang H, Polym. Compos., 38, 803 (2015)

[17] Zeng X, Yao Y, Gong Z, Wang F, Sun R, Xu J, Wong CP, Small, 11, 6205 (2015)

[18] Hu J, Huang Y, Yao Y, Pan G, Sun J, Zeng X, Sun R, Xu JB, Song B, Wong CP, ACS Appl. Mater. Interfaces, 9, 13544 (2017)

[19] Muhamad WAW, Ngah R, Jamlos MF, Soh PJ, Ali MT, Appl. Phys. A, 123, 102 (2016)

[20] Ling W, Gu A, Liang G, Yuan L, Polym. Compos., 31, 307 (2009)

[21] Won JM, Suk HJ, Wee D, Kim YH, Ka JW, Kim J, Ahn T, Yi MH, Jang KS, Org. Electron., 14, 1777 (2013)

[22] Wilson D, Stenzenberger HD, Hergenrother PM, Polymides, Springer, New York, 1990.

[23] Gurevitch I, Silverstein MS, J. Polym. Sci. A: Polym. Chem., 48(7), 1516 (2010)

[24] Yang J, Lee MH, Macromol. Res., 12(3), 263 (2004)

[25] Cameron NR, Polymer, 46(5), 1439 (2005)

[26] Zhu Y, Zhang R, Zhang S, Chu Y, Chen J, Langmuir, 32, 6083 (2016)

[27] Silverstein MS, Polymer, 55(1), 304 (2014)

[28] Bjorkegren S, Nordstierna L, Torncrona A, Palmqvist A, J. Colloid Interface Sci., 487, 250 (2017)

[29] Zhang S, Chen J, Chem. Commun., 16, 2217 (2009)

[30] Ding Y, Bikson B, Nelson JK, Macromolecules, 35(3), 905 (2002)

[31] Kim K, Kim S, Ryu J, Jeon J, Jang SG, Kim H, Gweon DG, Im WB, Han Y, Kim H, Choi SQ, AAPG Bull., 8, 14305 (2017)

[32] Park M, Park J, Jeong U, Nano Today, 9(2), 244 (2014)

[33] Tarkhanyan RH, Niarchos DG, Int. J. Therm. Sci., 67, 107 (2013)

[34] Kirby AJ, Polyimides: Materials, Processing and Applications, Pergamon Press Ltd., Oxford, 1992.

[35] Barber P, Balasubramanian S, Anguchamy Y, Gong S, Wibowo A, Gao H, Ploehn JH, Zur Loye HC, Materials, 2, 1697 (2009)