Sm 첨가에 따른 Al-Si-Cu 알루미늄 합금의 미세조직 및 열전도도 변화

최진주; 강유빈; 임병용; 이찬기; 김한구; 박광훈; 김대근; Jin-Ju Choi; Yubin Kang; Byoungyong Im; Chan-Gi Lee; Hangoo Kim; Kwang Hoon Park; Dae-Guen Kim

Korean Journal of Materials Research, Vol.30, No.1, 31-37, January, 2020

DOI10.3740/MRSK.2020.30.1.31 Export Citation

Sm 첨가에 따른 Al-Si-Cu 알루미늄 합금의 미세조직 및 열전도도 변화

Effect of Samarium Addition on Microstructure and Thermal Conductivity of Al-Si-Cu Aluminum Alloy

최진주, 강유빈, 임병용, 이찬기, 김한구¹, 박광훈², 김대근^†

고등기술연구원
¹㈜네덱
²인하대학교

Jin-Ju Choi, Yubin Kang, Byoungyong Im, Chan-Gi Lee, Hangoo Kim¹, Kwang Hoon Park², and Dae-Guen Kim^†

Materials Science and Chemical Engineering Center, Institute for Advanced Engineering(IAE), Yongin 17180, Republic of Korea
¹NEDEC, Seongnam 13494, Republic of Korea
²Program in Metals and Materials Process Engineering, Inha University, Incheon 22212, Republic of Korea

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In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 μm were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

Keywords:Al-Si-Cu al alloy;rare earth;Sm;hardness;thermal conductivity

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[4] Cho YH, Kim HW, Lee JM, Kim MS, J. Mater. Sci., 50(22), 7271 (2015)

[5] Shen YL, Needleman A, Suresh S, Metall. Mater. Trans. A-Phys. Metall. Mater. Sci., 25, 839 (1994)

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[7] Tan FL, Tso CP, Appl. Therm. Eng., 24, 159 (2004)

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[9] Huang HS, Weng YC, Chang YW, Chen SL, Ke MT, Int. Commun. Heat Mass Transfer., 37, 140 (2010)

[10] Kim CW, Choi JI, Kim SW, Kim YC, Kang CS, ICAA13 Pittsburgh. Springer Cham., 237 (2012).

[11] Nogita K, McDonald SD, Dahle AK, Mater. Trans., 45, 323 (2004)

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[14] HU Z, Yan H, Rao Y, Trans. Nonferrous Met. Soc. China., 23, 3228 (2013)

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[18] Kang HS, Yoon WY, Kim KH, Kim MH, Yoon YP, Cho IS, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 449, 334 (2007)

[19] Lu SZ, Hellawell A, J. Cryst. Growth, 73, 316 (1985)

[20] Suarez-Pena B, Asensio-Lozano J, Mater. Charact., 57, 218 (2006)

[21] Kobayashi T, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 280, 8 (2000)

[22] Chong C, LIU ZX, Bo R, WANG MX, WENG YG, LIU ZY, Trans. Nonferrous Met. Soc. China, 17, 301 (2007)

[23] Weixi S, Bo G, Ganfeng T, Shiwei L, Yi H, Fuxiao Y, J. Rare Earths, 28, 367 (2010)

[24] Stadler F, Antrekowitsch H, Fragner W, Kaufmann H, Pinatel ER, Uggowitzer PJ, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 560, 481 (2013)