화학공학소재연구정보센터
Journal of Industrial and Engineering Chemistry, Vol.83, 90-99, March, 2020
Mutual intercropping-inspired co-silanization to graft well-oriented organosilane as adhesion promotion nanolayer for flexible conductors
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Surface metallization of polymer substrate and film adhesion are crucial to the development of flexible electronics. This study demonstrates the co-silanization engineering on the polyimide (PI) film by mutual intercropping of two organosilane molecules to improve their grafting orientability and enhance the adsorbability toward the PI substrate and loaded metal atoms. The mutual intercropping-inspired cosilanization engineering is implemented by using 3-[(trimethylsilyl)ethynyl]pyridine (TEP) as a supporting organosilane to spatially confine the grafting orientation of the supported aminosilane, 3- [2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane (ETAS), leading to the formation of a welloriented organosilane composite nanolayer as adhesion promotion layer for flexible conductors. The flexible Cu conductor electrolessly deposited on the PI film by co-silanization shows improved adhesion strength (0.9 kgf/cm) compared to those based on mono-silanization (0.51 kgf/cm) and sputtered Ta/Cu (0.4 kgf/cm). Superior deformability (bendability) was also achieved for the co-silanized Cu/PI sample by retaining good electrical property after bending cycle up to 1000.
  1. Cai J, Zhang C, Khan A, Wang L, Li WD, ACS Appl. Mater. Interfaces, 10, 28754 (2018)
  2. Huttunen-Saarivirta E, Yudin V, Myagkova L, Svetlichnyi V, Prog. Org. Coat., 72, 269 (2011)
  3. Chen WX, Zhou ZX, Yang TT, Bei RX, Zhang Y, Liu SW, Chi ZG, Chen XD, Xu JR, React. Funct. Polym., 108, 71 (2016)
  4. Ding Y, Hou H, Zhao Y, Zhu Z, Fong H, Prog. Polym. Sci, 61, 67 (2016)
  5. Melzer M, Monch JI, Makarov D, Zabila Y, Bermudez GSC, Karnaushenko D, Baunack S, Bahr F, Yan CL, Kaltenbrunner M, Schmidt OG, Adv. Mater., 27(7), 1274 (2015)
  6. Teo AJ, Mishra A, Park I, Kim YJ, Park WJ, Yoon YJ, ACS Biomater. Sci. Eng., 2, 454 (2016)
  7. Gao Y, Li Q, Wu R, Sha J, Lu Y, Xuan F, Adv. Funct. Mater., 29 (2019)
  8. Choi WK, Park DH, Surf. Coat. Technol., 203, 2739 (2009)
  9. Lu YX, Appl. Surf. Sci., 256(11), 3554 (2010)
  10. Marshall JA, Proc. IPC, 1 (2015).
  11. Kim HS, Kim BO, Seo JH, J. Nanosci. Nanotechnol., 15, 8743 (2015)
  12. Cordill MJ, Kleinbichler A, Volker B, Kraker P, Economy DR, Tobbens D, Kirchlechner C, Kennedy MS, Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process., 735, 456 (2018)
  13. Pavlenko V, Cherkashina N, Zaitsev S, Acta Astronaut., 160, 489 (2019)
  14. Wu PY, Lin CH, Chen CM, Metals, 7, 189 (2017)
  15. Sawada S, Masuda Y, Zhu PX, Koumoto K, Langmuir, 22(1), 332 (2006)
  16. Mobius A, Elbick D, Weidlich ER, Feldmann K, Schuessler F, Borris J, Thomas M, Zanker A, Klages CP, Electrochim. Acta, 54(9), 2473 (2009)
  17. Chen JJ, Lin GQ, Wang Y, Sowade E, Baumann RR, Feng ZS, Appl. Surf. Sci., 396, 202 (2017)
  18. Lee KW, Kowalczyk SP, Shaw JM, Macromolecules, 23, 2097 (1990)
  19. Yu WX, Hong L, Chen BH, Ko TM, J. Mater. Chem., 13, 818 (2003)
  20. Suh SW, Kim JJ, Kim SH, Park BK, J. Ind. Eng. Chem., 18(1), 290 (2012)
  21. Cherng SJ, Chen CM, Dow WP, Lin CH, Chen SW, Electrochem. Solid State Lett., 14(7), P13 (2011)
  22. Matsumura Y, Enomoto Y, Tsuruoka T, Akamatsu K, Nawafune H, Langmuir, 26(14), 12448 (2010)
  23. Ikeda S, Yanagimoto H, Akamatsu K, Nawafune H, Adv. Funct. Mater., 17(6), 889 (2007)
  24. Inagaki N, Tasaka S, Baba T, J. Adhes. Sci. Technol., 15(7), 749 (2001)
  25. Inagaki N, Tasaka S, Onodera A, J. Appl. Polym. Sci., 73(9), 1645 (1999)
  26. Osaka T, Wakatsuki S, Masuda T, Yoshino M, Yamachika N, Sasano J, Matsuda I, Okinaka Y, Electrochemistry, 76, 191 (2008)
  27. Li Y, Chen DS, Lu QH, Qian XF, Zhu ZK, Yin J, Appl. Surf. Sci., 241(3-4), 471 (2005)
  28. Wang WC, Vora RKH, Kang ET, Neoh KG, Macromol. Mater. Eng., 288, 152 (2003)
  29. Kim H, Jang J, Polymer, 41, 6533 (2000)
  30. Li L, Yan GP, Wu JY, Yu XH, Guo QZ, Kang ET, Appl. Surf. Sci., 254(22), 7331 (2008)
  31. Kim HJ, Park YJ, Choi JH, Han HS, Hong YT, J. Ind. Eng. Chem., 15(1), 23 (2009)
  32. You JB, Kim SY, Park YJ, Ko YG, Im SG, Langmuir, 30(3), 916 (2014)
  33. Yu ZJ, Kang ET, Neoh KG, Polymer, 43(15), 4137 (2002)
  34. Wang WC, Kang ET, Neoh KG, Appl. Surf. Sci., 199(1-4), 52 (2002)
  35. Jeon EB, Joo SJ, Ahn H, Kim HS, Thin Solid Films, 603, 382 (2016)
  36. Hu MH, Noda S, Okubo T, Yamaguchi Y, Komiyama H, Appl. Surf. Sci., 181(3-4), 307 (2001)
  37. Xie Y, Hill CA, Xiao Z, Militz H, Mai C, Compos. A: Appl. Sci. Manuf., 41, 806 (2010)
  38. Munief WM, Heib F, Hempel F, Lu XL, Schwartz M, Pachauri V, Hempelmann R, Schmitt M, Ingebrandt S, Langmuir, 34(35), 10217 (2018)
  39. Chen WH, Tseng YT, Hsieh S, Liu WC, Hsieh CW, Wu CW, Huang CH, Lin HY, Chen CW, Lin PY, RSC Adv., 4, 46527 (2014)
  40. Tseng YT, Lu HY, Li JR, Tung WJ, Chen WH, Chau LK, ACS Appl. Mater. Interfaces, 8, 34159 (2016)
  41. Mikic A, Cupina B, Mihailovic V, Krstic D, Dordevic V, Peric V, Srebric M, Antanasovic S, Marjanovic-Jeromela A, Kobiljski B, Models and Ideotypes, Springer, pp.161 2012.
  42. Cupina B, Mikic A,Stoddard FL, Krstic D, Justes E, Bedoussac L, Fustec J, Pejic B, Springer, pp.347 2011.
  43. Lai KC, Wu PY, Chen CM, Wei TC, Wu CH, Feng SP, J. Electron. Mater., 45, 4813 (2016)
  44. Wei TC, Pan TC, Chen CM, Lai KC, Wu CH, Electrochem. Commun., 54, 6 (2015)
  45. Kostecki R, Schnyder B, Alliata D, Song X, Kinoshita K, Kotz R, Thin Solid Films, 396(1-2), 36 (2001)
  46. Zhang X, Mao L, Du J, Wei HJ, J. Sol Gel Sci. Technol., 69, 498 (2014)
  47. Abdelhameed M, Aly S, Lant JT, Zhang X, Charpentier P, Sci. Rep., 8, 17068 (2018)
  48. Yao Y, Ma YZ, Qin M, Ma XJ, Wang C, Feng XZ, Colloids Surf. B: Biointerfaces, 66, 233 (2008)
  49. Chang Y, Tao Y, Zhang Q, Yang ZG, Electrochim. Acta, 158, 7 (2015)
  50. Li HY, Wang RG, Hu HL, Liu WB, Appl. Surf. Sci., 255(5), 1894 (2008)
  51. Niu FX, Wang YX, Zhang YT, Xie SK, Ma LR, Wang CG, Mao YP, J. Mater. Sci., 54(3), 2181 (2019)
  52. Liu W, Xu L, Sheng K, Chen C, Zhou X, Dong B, Bai X, Zhang S, Lu G, Song H, J. Mater. Chem. A, 6, 10976 (2018)
  53. Zhao L, Mitomo H, J. Appl. Polym. Sci., 110(3), 1388 (2008)
  54. Shen Z, Dai W, Liu Y, Ding Y, Xia Y, IOP Conf. Ser.: Mater. Sci. Eng., 381 (2018)
  55. Raymundo-Pinero E, Cazorla-Amoros D, Linares-Solano A, Find J, Wild U, Schlogl R, Carbon, 40, 597 (2002)
  56. Ye WC, Chen Y, Zhou YX, Fu JJ, Wu WC, Gao DQ, Zhou F, Wang CM, Xue DS, Electrochim. Acta, 142, 18 (2014)
  57. Salon MCB, Bayle PA, Abdelmouleh M, Boufi S, Belgacem MN, Colloids Surf. A: Physicochem. Eng. Asp., 312, 83 (2008)
  58. Cai Y, Li J, Yi LM, Yan XJ, Li JW, Appl. Surf. Sci., 450, 102 (2018)