화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.83, 224-234, March, 2020
DOI10.1016/j.jiec.2019.11.032  Export Citation
Microcapsules derived from Pickering emulsions as thermal latent curing accelerator for epoxy resins
Bowen Zhang, Yingying Zhao, Xin Sun, Xiaoma Fei1, Wei Wei†, Xiaojie Li, and Xiaoya Liu
  • Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, P.R. China
  • 1Wuxi Chuangda Advanced Materials Co., Ltd., Wuxi, Jiangsu 214028, P.R. China
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Organic-inorganic hybrid microcapsules encapsulating 2-phenylimidazole (2-PhIm) were prepared by Pickering emulsion polymerization of styrene and divinyl benzene using methacryloyloxy silanemodified silica particles as the stabilizer, and served as a thermal latent curing accelerator for diglycidylether of bisphenol A epoxy/anhydride system. The one-component curing composition containing 5 wt% of the microcapsules exhibited an excellent storage stability. The pot life at room temperature was as long as 30 days, while which of 2-PhIm curing system was only 2 days. At elevated temperature, the encapsulated 2-PhIm could be released from microcapsules effectively, and instantly accelerated the curing reaction. Meanwhile, the addition of microcapsules did not cause an adverse effect on the thermomechanical performance of the epoxy thermosets. In addition, the latency and curing behavior could be facilely regulated at a wide range of temperature by adjusting monomer ratios of the polymer matrix, to match different process temperatures. The microcapsules with robust cross-linked polystyrene matrix structure also showed good resistance to shearing forces, indicating their feasibility for high-speed mixing or kneading process in practical applications. It is suggested that the novel latent curing accelerator is potential for high-performance one-pot epoxy formulations, particularly recommended for application in electronic packaging fields.
Keywords:Hybrid microcapsule;Curing accelerator;Epoxy resin
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