A new kind of inorganic adhesive for Si bonding has been developed by mixing polypermethylcyclosilazane (PMSZ), polycarbosilane, and silicon powders with xylene. Chemically and thermally stable bonded materials with more than 100 MPa of bonding strength are formed after heating at 1200 degrees C in Ar. Plasticizer effect of PMSZ and the formation of porous structures after firing may cause the crack-free bonding. Metal ion impurities in the adhesives can be reduced to render the materials suitable for semiconductor processing tools.