The electromigration (EM) performance of W-plug via-fed lead test structures has been investigated. It was observed that the median time-to-failure (MTTF) and time-to-failure dispersion (sigma) depended on the number of vias servicing the lead. With multiple-vias feeding the metal lead. the early times-to-failure tended to be suppressed. In general, as the number of W-plug vias feeding the metal lines increases, MTTF tended to increase and sigma tended to decrease. Also, the activation energy (0.85 eV) observed during this via-fed EM study is consistent with reports of interfacial diffusion.