In order to clarify aspects of dealloying and stress corrosion cracking of copper-gold alloys, the electrochemical oxidation behavior of pure polycrystalline gold in 0.6 M NaCl and in 0.3 M Na2SO4 solutions was studied using low-scan rate cyclic potentiodynamic polarization, potential stepping, and Scratching techniques. During cyclic polarization (0.2 mV/s); a limiting current density (anodic current plateau) was observed over the potential region from 200 to 600 mV/SCE, independent of the oxygen concentration, the stirring of the solution, or the presence of complexing or noncomplexing ions. Consistent with previous findings in the literature, the anodic current plateau was assumed to be associated with the formation of a two-dimensional, submonolayer, hydrous Au-O surface film, eventually transforming into a thicker oxide film. The measured limiting current density (0.1 mA/cm(2)) was approximately one tenth of that previously observed for Cu-25 atom percent (a/o) Au between 300 and 430 mV/SCE, the domain of observed stress-corrosion cracking for this alloy, in which case the current is mainly due to selective dissolution of copper. The current transients produced by both potential stepping and scratching of gold in the potential region of the anodic plateau were compared with transients observed for Cu-25 a/o Au. Arguments were made for attributing these to the faradaic reformation of the hydrous Au-O film and the faradaic selective dissolution of copper to form gold of submonolayer coverage, respectively. It was found that the current transients produced on scratching gold decay exponentially over the first similar to 50 ms followed by an inverse power-law decay up to the end of the measuring period of 400 ms. The significance of these results to transgranular stress-corrosion cracking of copper-gold alloys is discussed.