Behavior and Adhesion Performance of Acrylic PSAs using Semi-IPN Structure and UV/UV Stepwise Curing

Gyu-Seong Shim; Ji-Soo Kim; Hyun-Joong Kim

Journal of Industrial and Engineering Chemistry, Vol.89, 139-146, September, 2020

DOI10.1016/j.jiec.2020.04.020 Export Citation

Behavior and Adhesion Performance of Acrylic PSAs using Semi-IPN Structure and UV/UV Stepwise Curing

Gyu-Seong Shim¹, Ji-Soo Kim¹, and Hyun-Joong Kim^{1, 2, †}

¹Laboratory of Adhesion and Bio-Composites, Program in Environmental Materials Science, College of Agriculture and Life Sciences, Republic of Korea
²Research Institute of Agriculture and Life Sciences, College of Agriculture and Life Sciences, Seoul National University, Seoul 08826, Republic of Korea

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Pressure-sensitive adhesives (PSAs) and UV-curable acrylic systems are widely utilized. In particular, PSAs have currently attracted significant attention because of their utility and applicability for manufacturing re-useable modules for smart devices. In this study, adhesion properties, UV-curing behavior, viscoelastic properties, and gel fraction were investigated. The UV/UV step curing process was utilized to overcome limitations, such as re-work or gap filling. The difference in physical properties between primary curing and secondary curing was confirmed. In addition, by adjusting the content of the crosslinking agent, the experiment based on controlling the structure of the semi-interpenetrating polymer network was conducted. We determined that physical properties varied with the crosslinking agent content. The degree of crosslinking was high, whereas the crosslinking density was low for 0.1-0.3 phr. However, both the degree of crosslinking and the crosslinking density increased for 0.5-1 phr.

Keywords:Step curing;UV curing;PSA;Photo-DSC;Mechanical properties;Adhesive;Pressure-sensitive adhesives

[References]

Benedek I, Pressure-sensitive adhesives and applications, CRC Press, 2004.
Park SH, Lee TH, Park YI, Noh SM, Kim JC, J. Ind. Eng. Chem., 53, 111 (2017)
Jovanovic R, Dube M, J. Macromol. Sci.-Polym. Rev, 44, 1 (2004)
Jin T, Pan Y, Jeon GJ, Yeom HI, Zhang S, Paik KW, Park SHK, ACS Applied Materials & Interfaces (2020).
Lee SW, Park JW, Park CH, Kim HJ, Kim EA, Woo HS, Int. J. Adhes. Adhes., 47, 21 (2013)
Czech Z, Butwin A, Gluch U, Kabatc J, J. Appl. Polym. Sci., 123(1), 118 (2012)
Czech Z, Kowalczyk A, Ga˛siorowska M, Soroka J, Kabatc J, Int. J. Adhes. Adhes., 31, 634 (2011)
Kajtna J, Krajnc M, Int. J. Adhes. Adhes., 31, 822 (2011)
Noori H, Jain M, Nielsen K, Brandys F, Int. J. Adhes. Adhes., 85, 219 (2018)
Jin ML, Park S, Kim JS, Kwon SH, Zhang S, Yoo MS, Jang S, Koh HJ, Cho SY, Kim SY, Adv. Mater., 30, 170685 (2018)
Zhang S, Lin T, He P, Paik KW, Microelectronics Reliability, 78, 181 (2017)
Lee JG, Shim GS, Park JW, Kim HJ, Moon SE, Kim YK, No DH, Kim JH, Han KY, J. Electron. Mater., 45, 3786 (2016)
Wang W, Wang A, Carbohydr. Polym., 80, 1028 (2010)
Shim GS, Kim JS, Back JH, Jang SW, Park JW, Kim HJ, Choi JS, Yeom JS, Int. J. Adhes. Adhes., 96, 102445 (2020)
Park JW, Shim GS, Lee JG, Jang SW, Kim HJ, Choi JN, Materials, 11, 509 (2018)
Mateo J, Bosch P, Catalina F, Sastre R, J. Polym. Sci. A: Polym. Chem., 30, 829 (1992)
Kim JS, Shim GS, Baek D, Back JH, Jang SW, Kim HJ, Choi JS, Yeom JS, Express Polymer Letters, 13, 794 (2019)
Lee JG, Shim GS, Park JW, Kim HJ, Han KY, Int. J. Adhes. Adhes., 70, 249 (2016)
Joo HS, Do HS, Park YJ, Kim HJ, J. Adhes. Sci. Technol., 20(14), 1573 (2006)
Park YJ, Lim DH, Kim HJ, Park DS, Sung IK, Int. J. Adhes. Adhes., 29, 710 (2009)
Lee SW, Lee TH, Park JW, Park CH, Kim HJ, Song JY, Lee JH, J. electronic materials, 43, 4246 (2014)
Joo HS, Park YJ, Do HS, Kim HJ, Song SY, Choi KY, J. Adhes. Sci. Technol., 21(7), 575 (2007)

[Referenced By]

[1] Benedek I, Pressure-sensitive adhesives and applications, CRC Press, 2004.

[2] Park SH, Lee TH, Park YI, Noh SM, Kim JC, J. Ind. Eng. Chem., 53, 111 (2017)

[3] Jovanovic R, Dube M, J. Macromol. Sci.-Polym. Rev, 44, 1 (2004)

[4] Jin T, Pan Y, Jeon GJ, Yeom HI, Zhang S, Paik KW, Park SHK, ACS Applied Materials & Interfaces (2020).

[5] Lee SW, Park JW, Park CH, Kim HJ, Kim EA, Woo HS, Int. J. Adhes. Adhes., 47, 21 (2013)

[6] Czech Z, Butwin A, Gluch U, Kabatc J, J. Appl. Polym. Sci., 123(1), 118 (2012)

[7] Czech Z, Kowalczyk A, Ga˛siorowska M, Soroka J, Kabatc J, Int. J. Adhes. Adhes., 31, 634 (2011)

[8] Kajtna J, Krajnc M, Int. J. Adhes. Adhes., 31, 822 (2011)

[9] Noori H, Jain M, Nielsen K, Brandys F, Int. J. Adhes. Adhes., 85, 219 (2018)

[10] Jin ML, Park S, Kim JS, Kwon SH, Zhang S, Yoo MS, Jang S, Koh HJ, Cho SY, Kim SY, Adv. Mater., 30, 170685 (2018)

[11] Zhang S, Lin T, He P, Paik KW, Microelectronics Reliability, 78, 181 (2017)

[12] Lee JG, Shim GS, Park JW, Kim HJ, Moon SE, Kim YK, No DH, Kim JH, Han KY, J. Electron. Mater., 45, 3786 (2016)

[13] Wang W, Wang A, Carbohydr. Polym., 80, 1028 (2010)

[14] Shim GS, Kim JS, Back JH, Jang SW, Park JW, Kim HJ, Choi JS, Yeom JS, Int. J. Adhes. Adhes., 96, 102445 (2020)

[15] Park JW, Shim GS, Lee JG, Jang SW, Kim HJ, Choi JN, Materials, 11, 509 (2018)

[16] Mateo J, Bosch P, Catalina F, Sastre R, J. Polym. Sci. A: Polym. Chem., 30, 829 (1992)

[17] Kim JS, Shim GS, Baek D, Back JH, Jang SW, Kim HJ, Choi JS, Yeom JS, Express Polymer Letters, 13, 794 (2019)

[18] Lee JG, Shim GS, Park JW, Kim HJ, Han KY, Int. J. Adhes. Adhes., 70, 249 (2016)

[19] Joo HS, Do HS, Park YJ, Kim HJ, J. Adhes. Sci. Technol., 20(14), 1573 (2006)

[20] Park YJ, Lim DH, Kim HJ, Park DS, Sung IK, Int. J. Adhes. Adhes., 29, 710 (2009)

[21] Lee SW, Lee TH, Park JW, Park CH, Kim HJ, Song JY, Lee JH, J. electronic materials, 43, 4246 (2014)

[22] Joo HS, Park YJ, Do HS, Kim HJ, Song SY, Choi KY, J. Adhes. Sci. Technol., 21(7), 575 (2007)