Novel electroless plating of silver nanoparticles on graphene nanoplatelets and its application for highly conductive epoxy composites

Yingjie Qian; Sosan Hwang; Jaewon Lee; Jin Sung Seo; Sung-Hyeon Baeck; Sang Eun Shim

Journal of Industrial and Engineering Chemistry, Vol.96, 156-162, April, 2021

DOI10.1016/j.jiec.2021.01.014 Export Citation

Novel electroless plating of silver nanoparticles on graphene nanoplatelets and its application for highly conductive epoxy composites

Yingjie Qian, Sosan Hwang, Jaewon Lee, Jin Sung Seo, Sung-Hyeon Baeck , and Sang Eun Shim^†

Department of Chemical Engineering, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, South Korea

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With the aim to develop electrically conductive adhesives (ECAs) as alternatives for traditional leadbased or lead-free solders in electronic packaging, we report an outstanding enhancement of electrical conductivity of epoxy ECAs filled with silver nanoparticles (AgNP)-decorated graphene nanoplatelets (AgNP@GNP). In order to avoid the deterioration of the superior properties of GNP, the GNP is directly sensitized by Sn precursor without conventional harsh-conditioned graphene oxide (GO) preparation, followed by the decoration of AgNP on sensitized GNP. The structural and morphological properties of AgNP@GNP were characterized using XRD, TEM, Raman, and TGA. The excellent distribution of SnO2 and AgNP on GNP could be explained by the attractive force between protonated GNP (pH < 1; zeta potential > +20 mV) and lone-paired stannous ions. The electrical conductivity of as-prepared AgNP@GNP (1.3 x 105 S/cm) was nearly 6500 times than that of pristine GNP. Moreover, the electrical conductivity of the 20 vol% AgNP@GNP/epoxy ECAs was almost 500 times higher than that of pristine GNP/epoxy and 27-fold higher than that of conventional AgNP@GO/epoxy ECA.

Keywords:Electrically conductivity;Graphene nanoplatelet;Silver nanoparticles

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