W-Cu functionally graded composites (FGCs) up to six layers have been developed using high energy ball milling and spark plasma sintering (SPS) at a lower temperature of 900 degrees C. The relative density of W-Cu composites increased from 85.4% (W80Cu20 layer) to 95.7% (W20Cu80 layer) with increasing Cu content. All the W-Cu FGCs exhibited a graded structure even after SPS and showed a gradual change in hardness, Young's modulus, and coefficient of thermal expansion (CTE). Furthermore, W-Cu composites showed a CTE and modulus between those of W and Cu and could be used as an intermediate layer between W and Cu in plasma facing components. The thermal cycle testing at 800 degrees C has confirmed that the W-Cu FGCs developed in this study can withstand thermal shock and showed a superior performance over directly bonded W-Cu sample. The W-Cu FGCs developed in the present study are not only suitable for plasma facing components but can also be used where the thermal stresses are introduced due to the large mismatch in CTE or elastic modulus. (C) 2020 The Society of Powder Technology Japan. Published by Elsevier B.V. and The Society of Powder Technology Japan. All rights reserved.