Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology A, Vol.12, No.6, 3087-3090, 1994 DOI10.1116/1.578940 Export Citation Plasma and Processing Effects of Electrode Spacing for Tungsten Etchback Using a Bipolar Electrostatic Wafer Clamp Marx WF, Ra YJ, Yang R, Chen CH Keywords:CHUCK Please enable JavaScript to view the comments powered by Disqus.
