Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology A, Vol.13, No.3, 590-595, 1995 DOI10.1116/1.579791 Export Citation Chemical-Vapor-Deposited Ticn - A New Barrier Metallization for Submicron via and Contact Applications Eizenberg M, Littau K, Ghanayem S, Liao M, Mosely R, Sinha AK Keywords:THIN-FILMS;TITANIUM NITRIDE;AMMONIA Please enable JavaScript to view the comments powered by Disqus.
