Terephthalic acid-based supramolecular metallogel of Cu(II) (ie, Cu-TA) is developed by sonicating the mixture of copper(II) acetate monohydrate and terephthalic acid in N,N-dimethyl formamide solvent. The rheological study is performed to expose the mechanical property of metallogel. The flake-like morphological patterns are found through FESEM microstructural investigations. The formation strategy, crystalline nature, and thermal behavior of the Cu-TA metallogel are also studied. The optical and electrical properties of Cu-TA metallogel are exhaustively scrutinized, and the measured data show that Cu-TA metallogel is semiconducting in nature. The electrical analysis indicates that the conductivity of Cu-TA metallogel increased up to similar to four times under illumination (7.49 x 10(-5) S m(-1)) rather than the nonirradiation condition (1.83 x 10(-5) S m(-1)). The measured I-V characteristics of Cu-TA metallogel-based thin-film metal-semiconductor (MS) junction devices under irradiation and nonirradiation conditions show a nonlinear rectifying behavior, typical of a Schottky diode (SD).