It is necessary to theoretically research wettability in superhydrophobic surface fabrication. Here, a numerical calculation approach is proposed for determining the contact angle of the water droplets on array micropillars by wire electrical discharge machining (WEDM). A hierarchical model is employed for these array microstructures, including mechanical analysis for a water droplet placed on a smooth array and wettability evaluation on the morphology of the WEDM surface. On pillars, equations are listed to solve the apparent contact angle according to force balance of gravity, tension, and pressure. As for the WEDM morphology, temperature simulation and measurement are carried out, and then the effect of roughness on surface wettability is studied. Constructed formulas predict the contact angle, and then the effect of geometric dimensions is obtained. In order to verify the assumption, array micropillars with different cross-profiles are prepared using high-speed WEDM on the AI alloy surface. Through the results of contact angle determination, the numerical calculation is carried out. This theoretical prediction is beneficial for improving the fabrication of the superhydrophobic surface by WEDM.