화학공학소재연구정보센터
Journal of Vacuum Science & Technology A, Vol.17, No.6, 3505-3508, 1999
Innovation of the fore pump and roughing pump for high-gas-flow semiconductor processing
A new screw pump has been developed as a useful backing pump for high-gas-flow semiconductor processing. The characteristic features of the screws are unequal lead and unequal slant angle, which realize higher pumping speed and smaller volume of the pumping system. This pump has a very wide dynamic range of 10(-3)-760 Torr with a high pumping speed and low electric power consumption by gradational lead screw structure and check valve at outlet. Furthermore, this pump is fl-ee from byproduct deposition, corrosion of inner surface and oil degradation. The backdiffusion of oils can be suppressed by admitting the N-2 purge gas flow larger than 10 seem to the inlet side of the pump.