Characterization of Thin Copper-Films Grown via Chemical-Vapor-Deposition Using Liquid Coinjection of Trimethylvinylsilane and (Hexafluoroacetylacetonate) Cu (Trimethylvinylsilane)

Parmeter JE; Petersen GA; Smith PM; Apblett CA; Reid JS; Norman JA; Hochberg AK; Roberts DA; Omstead TR

Journal of Vacuum Science & Technology B, Vol.13, No.1, 130-136, 1995

Parmeter JE, Petersen GA, Smith PM, Apblett CA, Reid JS, Norman JA, Hochberg AK, Roberts DA, Omstead TR

Keywords:CU(I) VINYLTRIMETHYLSILANE;TITANIUM NITRIDE;SELECTIVITY;RESISTIVITY;PRECURSORS;MORPHOLOGY;PLASMA;METAL