Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.15, No.2, 373-373, 1997 Export Citation Scaling of Si and GaAs Trench Etch Rates with Aspect Ratio, Feature Width, and Substrate-Temperature (Vol 13, Pg 92, 1995) Bailey AD, Vandesanden MC, Gregus JA, Gottscho RA Please enable JavaScript to view the comments powered by Disqus.
