Predicting the temperature rise during electron-beam lithography (EBL) is an important practical problem in the development of new EEL systems and in the optimization of new exposure processes. The TEMPTATION software tool was developed. This software uses an analytic solution of heat propagation in a multilayered substrate. The software attains both high speed and good accuracy. Experimental verification of the software was done. Simulated data were verified versus experiments made with variably shaped EEL systems using three different resists. Change of effective absorbed energy due to heating was simulated and compared to published data. Good agreement of predicted and measured data for both long-range and short-range resist heating was shown.