A novel method for quantitative analysis of the adhesion property of a resist micropattern is demonstrated experimentally. By applying a normal load directly with a microcantilever tip, a photoresist micropattern adhering to a substrate can be collapsed easily. The load, when the pattern collapse occurred, increased with the heating temperature of the resist pattern. The detectable sensitivity of this method can be estimated as less than 0.1 nN. The validity and reliability of this method are discussed by comparing with the adhesion result of the conventional peeling test.