We detail a novel three dimensional (3D) patterning capability for focused ion beam technology which uses, as a resist, a gold cluster compound Au-55(PPh3)(12)Cl-6. The high-resolution 3D morphology of the patterned structures is examined and electrical characterization analyses are carried out. Patterns having minimal lateral dimension about 30 nm and vertical resolution below 10 nm, are displayed using this method. Direct writing speeds up to 3.6 10(3) mu m/s were reached.