A postexposure bake (PEB) model for JSR KRF-K2G resist has been established fur bake temperature and time effects based on using large area exposures on production equipment. Data from top antireflective coated (TARC) K2G resist were well behaved and provided key understanding of the FEB processes. Data from K2G without TARC showed inhibition of surface dissolution that is possibly due to photoacid evaporation. Both processes showed an intrinsic thickness reduction of 50 nm in the first 30 s of FEB and then a continued decrease of 4 nm/min of bake time. This model was fit with the dissolution rates deduced from the coated K2G as a function of activated site concentration. The rates from large area data agree well with dissolution rate monitor (DRM) data and the DRM simulation allowed characterization of the depth dependent effects due to evaporation when TARC was not applied. The methodology of large area exposure allowed the simulation parameters to be quantitatively determined effectively.