A scanning tunneling microscope (STM) has been used to define features having critical dimensions ranging from 0.05 to 5.0 mum within a self-assembled monolayer resist of octadecyl mercaptan, HS(CH2)17-CH3, confined to a Au(111) surface. Low temperature chemical vapor deposition (CVD) methods were used to metalize the STM-patterned surface with Cu. At substrate temperatures near 120-degrees-C, the Cu CVD precursor, hexafluoroacetylacetonatocopper(I)-(1,5-cyclooctadiene), disproportionates to deposit Cu on the STM-etched portion of the substrate, but not on the unetched methyl-terminated monolayer resist surface. At substrate temperatures significantly above 120-degrees-C the degree of selectivity is reduced, probably as a result of thermal desorption of the organomercaptan monolayer.