A new method is described for the electroless deposition of copper onto acrylonitrile-butadiene-styrene (ABS) plastic. Etched ABS plastic was dipped directly into PdSO4 solution instead of the usual sensitization followed by activation. Experimental results show that the Pd2+ ions from PdSO4 solution are coordinated to the polar groups (i.e. -COOH, -SO3H..., etc.) on the surface of the etched ABS, resulting in the formation of ABS-Pb2+ complex. In an electroless copper bath containing a formaldehyde (HCHO) reducing agent, the ABS-Pd2+ complex is reduced to product Pd-0 atoms, which then act as catalysts and initiate the deposition of copper metal. Initially, the copper deposition rate was slow; however, it rose to that for conventional methods in about 10 min.