Polymer Engineering and Science, Vol.35, No.2, 184-189, 1995
Investigation of Cure in Epoxy Acrylate Resins Using Rheological and Dielectric Measurements
Dielectric and theological measurements are reported for the cure in a series of mixtures of an epoxy-acrylate with n-butyl methacrylate. The level of the initiator and proportions of the epoxy acrylate and n-butyl methacrylate influence the cure characteristics and morphology of the film formed. Analysis of the theological data indicates that during the curing process, microphase separation occurs within the mixture. The changes in the dielectric relaxation behavior with composition of the completely cured material is also consistent with microphase separation occurring in these resins while they are cured.