Thin Solid Films, Vol.248, No.2, 204-211, 1994
Adhesion Studies of Sputtered Aluminum Films on Xc-70 Steel Substrates - Effects of the Application of a Bias Voltage on the Substrate During Deposition
The adhesion strength of sputtered aluminium films to XC 70 steel substrates has been studied using the scratch adhesion test. The influence of the application of a bias voltage on the substrate during deposition was investigated by means of a mean critical load derived from a Weibull-like statistical analysis. It was found that in the absence of bias, the interface is rather abrupt, while the interface obtained with the application of a bias voltage is much more diffuse. We can consider that the widening of the interfacial region offers a better film anchorage on its substrate, requiring a stylus load value clearly excessively high to produce an adhesion failure.
Keywords:COPPER-FILMS;ION-BOMBARDMENT;SCRATCH TEST;SURFACE PRETREATMENTS;TITANIUM NITRIDE;HARD COATINGS;TIC FILMS;NICKEL;TEMPERATURE;ENHANCEMENT