Previous Article Next Article Table of Contents Thin Solid Films, Vol.262, No.1-2, VII-VIII, 1995 DOI10.1016/0040-6090(95)06624-1 Export Citation Copper-Based Metallization and Interconnects for Ultra-Large-Scale Integration Applications Alford TL, Li J, Mayer JW, Wang SQ Please enable JavaScript to view the comments powered by Disqus.
