Thin Solid Films, Vol.266, No.1, 58-61, 1995
X-Ray Photoelectron-Spectroscopy Analysis of Thermal and Plasma-Treated Steel Substrates and Their Interface Formed with an Aluminum Layer
X-ray photoelectron spectroscopy was used to investigate the interface formed between thermally and plasma-treated steel substrates and an aluminium layer deposited on them. Enhancement in adhesion of the metal on thermally treated steel substrates is explained by the structure change of the aluminium layer. In contrast, plasma treatments induce morphological modifications of the steel surface and favour deformation of compounds between the steel and the metal which in turn improve the adhesive strength.
Keywords:SPUTTERED COPPER-FILMS;ADHESION