화학공학소재연구정보센터
Thin Solid Films, Vol.270, No.1-2, 522-525, 1995
Collimated Ti/Tin Contact and Barrier Layers for Sub 0.5 Mu-M CVD W-Filled Contact Holes
This paper describes collimated Ti/TiN bilayers which are used as diffusion barriers and adhesion layers for chemical vapour deposition tungsten-filled contacts and vias. The collimator used was a titanium collimator with hexagonal 5/8 inch diameter cells and an aspect ratio of 1.5:1. The manufacturability of this collimated process, where TiN is being sputtered from a non-nitrided target, is shown in terms of bottom and sidewall coverage, sheet resistance non-uniformity, and mechanical as well as in-film particle-particle data.