In the fabrication of liquid crystal displays (LCDs) having a thin film transistor active matrix, as used in personal computers, several films are deposited by plasma enhanced chemical vapour deposition (PCVD) and sputtering methods. Semiconducting a-Si:H films and insulating a-SiN films are synthesized from SiH4, H2, NH3, and N2 gases in PCVD systems using parallel plate RF electrodes, Interconnect and electrode films of Cr, Ti, Mo, Ta, Al, and indiumu-tin oxide are deposited in sputtering systems having planar magnetron cathodes. Large area glass substrates, ranging from 300 mm X 400 mm to 400 mm X 500 mm, are processed. Typical systems are categorized as in-line tray transfer or single substrate transfer cluster tool types. The configurations, key components, deposition processes, and film properties are described.