We report the first fabrication of ungated vertical thin-film-edge field emitters using chemical beam deposition techniques, and the first measurement of field electron emission from arrays of such emitters. The deposition method has been shown to result in optimal material and structural film properties which are required for low voltage operation of thin-film-edge field emitters. These characteristics include an extremely small grain size, low stress, high purity, uniform thickness and a vertical geometry. We have imaged well-resolved emission patterns by cathodoluminescence using the field-emitted electrons, and have measured well-behaved Fowler-Nordheim current-voltage characteristics. Other advantages, such as robustness and inexpensive manufacturing, are also discussed.