Two experimental techniques including the bulge test and depth sensing nanoindentation measurements were used to describe mechanical properties of titanium nitride (TiNx) thin films in terms of their growth morphology. Thin layers of titanium nitride (t = 400-700 nm) were deposited in a RF magnetron sputtering system on the Si(100) wafers containing a layer of low stress (LPCVD) silicon nitride. Variation of the Young's modulus, hardness, and residual stresses of the TiNx films versus deposition parameters such as the substrate bias voltage and nitrogen partial pressure was investigated. It was found that, in particular, the tensile residual stress of the films first increases with the substrate bias to a maximum, then drops to zero and converts to the compressive stress, that grows again with the negative bias. At the same time, both modulus and hardness monotonously rise with the substrate bias without any abrupt changes. The nanoindentation data extracted from dynamically loading-unloading of TiN films converged to the bulge test measurements for compact coatings, but diverged from the bulge test data for porous coatings. The morphology of the films were observed using scanning electron microscopy and the relationships from dynamically loading-unloading of TiN films converged to the bulge test measurements for compact coatings, but diverged from the between microstructural evolution of columns and mechanical properties of coatings are discussed in terms of deposition parameters.