We in this paper report different ways to realise thick diamond-like carbon (DLC) films with stress values lower than 0.5 GPa. Thick DLC films grown by conventional r.f. self bias technique often delaminate from the substrates due to the presence of high compressive stresses of the order of 4-7 GPa. We have made an in-depth study of the delamination problem of DLC films at NPL and found that only for substrates kept away from the plasma (plume) it is possible to grow thick DLC films. This goes to show the heating of the substrates, when in contact with the plasma, appears to be one of the most important factors giving rise to the high stress values. Techniques that have produced consistently low stress values (0.2-0.5 GPa) in this laboratory are pulse plasma PECVD and the one using de saddle field fast atom beam source. Electronic properties of the materials so produced have been estimated by evaluating Urbach energy using photothermal deflection spectroscopy (PDS) measurements. A correlation between the unbound hydrogen in these films, as measured by a nuclear technique (ERDA), and the stress levels has been found. Deposition rate, room temperature conductivity, optical bandgap and refractive index have also been measured for these films.