Thin Solid Films, Vol.384, No.2, 185-188, 2001
Palladium thin film deposition on polyimide by CWAr+ laser radiation for electroless copper plating
Ar+ laser radiation (CW, 488 nm) is used to induce deposition of palladium (Pd) thin films onto polyimide surfaces from palladium-amine {[Pd(NH3)(4)](2+)} solutions. The chemical reaction is carried out by formaldehyde-assisted reduction of palladium-amine complex molecules to metallic Pd, and is localized on the polymer substrate by a focused and scanned Arf laser beam. The narrow (6-14 mum), homogeneous and thin (< 50 nm) palladium patterns are found to be excellent catalysts for further copper autocatalytic electroless deposition. Both the Pd and Cu layers are characterized by scanning electron microscopy (equipped with EDAX), a DEKTAK profiler and resistivity measurements.