Thin Solid Films, Vol.351, No.1-2, 32-36, 1999
High rate reactive sputtering using gas pulsing: a technique for the creation of films onto large, fat substrates
We call the conversion of a surface layer of an isolated material exposed to a reactive plasma: plasma anodization. The potential driving the ion reaction is given by the self-bias appearing on an insulating or isolated surface exposed to a dense plasma. This potential is usually quite small and only a thin layer is converted. In order to build up a significant thin film we have chosen to repeat the process with successive deposition and plasma-anodization processes. The use of an unbalanced planar magnetron to sputter both the material to be anodized and to provide the reactive plasma, when a suitable gas is admitted as a pulse controlled by discharge conditions recognized by optical emission or operating voltage, allows this successive pulse plasma anodization (SPPA) process to provide oxide films of high quality at a high rate on large area glass substrates.