A new sputter technique for high rate deposition of TiO2 was developed for applying to common planar magnetron sputter system. With this technique, using plasma sprayed TiO2-x targets and a sputter gas of a few percent of O-2 diluted with Ar, TiO2 films are deposited with a high deposition rate efficiency (deposition rate per applied power density) being almost eight times larger than that of the conventional sputter method using Ti target and O-2 sputter gas.