This study investigated the effect of saccharin on the internal stress and the adhesion of amorphous Ni-Cu-P deposited on aluminum. An amorphous Ni-Cu-P deposit with slight compressive stress can be produced when one adds 8-10 g/l saccharin into the Ni-Cu-P deposition solution. The stress relief mechanism was investigated. The addition of saccharin restrains the coalescence of the islands within Ni-Cu-P nodules and reverses the internal stress of the electroless Ni-Cu-P deposit from tensile to compressive. The adhesion strength of the Si/Ti/Al/ Ni-Cu-P multilayer specimen obtained with 10 gn saccharin is around 35 to 45 MPa, and the fracture occurs at the silicon substrate after the pull test. The shear strength of the Ti/Al/Ni-Cu-P bump (100 x 100 mu m) on Si is 132.9 +/- 12.7 g, and the fracture occurs at the Ni-Cu-P deposit after the shear test. Moreover, the inhibition of coalescence of the fine islands within Ni-Cu-P nodules increases the brightness and the hardness of the deposit.