Deposition of fluorocarbon plasma polymer films by means of rf sputtering of polytetrafluoroethylene (PTFE) has been performed in argon, nitrogen and in a self-sputtering mode. The average temperature of the target was found to be below the melting point of PTFE. Energy resolved mass spectrometry revealed the differences between the cases of argon and nitrogen working gases. The CFN compound and increased concentration of CFx fragments were observed in the plasma using N-2. High resolution XPS analysis revealed CN in these films and enhanced amount of CF2 groups. Wettability by means of contact angle of water droplet was assessed. Static contact angles approaching 105 degrees and 100 degrees were measured for fluorocarbon plasma polymer films sputtered in argon and nitrogen, respectively.