Cu/Ni-P multilayers, comprised of alternatively formed 'nano-size' sublayers of Cu and Ni-P, have been successfully produced from a single bath using modulated (i.e. periodic pulse control) current density. The chemical composition and the crystallinity of resultant deposits are influenced by the deposition current density. Transmission electron microscopy (TEM) examination of our multilayer sample clearly showed the formation of alternative sublayers of Cu and Ni-P (thickness similar to 50 nm). Electrolysis at a cathodic current density of 5 A/dm(2) yields a poorly crystallized Ni-P sublayer, while that at 10 A/dm(2) gives a crystalline one. Thus it is possible to obtain Cu/Ni-P multilayers with different crystallinity in the Ni-P sublayer by simply changing the cathodic current density.