Previous Article Next Article Table of Contents Journal of Materials Science Letters, Vol.18, No.3, 193-196, 1999 DOI10.1023/A:1006607711814 Export Citation Reaction phases at the interfaces between a Cu filler, an intermediate Ti layer, and Si3N4 Dummler W, Weber S, Tete C, Scherrer S Please enable JavaScript to view the comments powered by Disqus.
