The electrodeposition of Sn-Bi alloy (Sn, 97 wt%; Bi, 3 wt%) as a Pb-free solder using a polyoxyethylenelaurylether (POELE) additive was studied. The addition of POELE resulted in a smooth surface of the deposited alloy with uniform component distribution. The melting point of the electrodeposited Sn-Bi alloy was 218 degreesC, satisfying the industrial temperature requirements for Pb-free solders. It was found that POELE adsorbed on both deposited Sn and Bi surfaces inhibits the subsequent deposition during electrolysis, a significant finding for the alloy plating industry.