The atomic flux divergence due to electromigration, AFD(gen), has been formulated considering two-dimensional distributions of current density and temperature within polycrystalline and bamboo line structures without passivation. The divergence AFD(gen) has been identified as a governing parameter of electromigration damage by experimental verification. Recently, an AFD(gen)-based gen method for predicting the lifetime and failure site in an unpassivated bamboo line was proposed based on numerical simulation of the failure process of a metal line. Availing of the advantage of the universal method, the effects of corner position, comer angle and operating conditions on the lifetime and failure location in angled metal lines are discussed. The lifetime and failure location varied with the line shape and operating conditions. Understanding these effects on metal line failure gives important knowledge for enhancing the electromigration endurance of metal lines.