The effects of air agitation on electrolyte conductivity have been considered. Experimental data obtained from a conductivity probe was found to be comparable to theoretical models for conductivity which show that localized reductions of 20-30% are quite normal in an acid copper electrolyte. Such nonuniformity within an electroplating tank could be one cause of the throwing power/metal distribution variations which are normally attributed to surface irregularities or poorly designed agitation systems. These aspects have particular bearing for printed circuit board (PCB) manufacture where consistency in electrodeposition is paramount to ensure low defect or failure rates, especially within high aspect ratio through-holes.