화학공학소재연구정보센터
Journal of Applied Electrochemistry, Vol.30, No.10, 1163-1168, 2000
Diffusion coefficients of Cu(II) complexes with ligands used in alkaline electroless copper plating solutions
The diffusion coefficient values of the Cu(II) complex compounds with EDTA, DTPA, NTA, Quadrol, glycerol, saccharose, (+)- and (+/-)-tartaric acid, OH- ions obtained by polarographic measurements in alkaline solutions lie in the range (1.2-5.7) x 10(-6) cm(2) s(-1) (at 20 degreesC and J = 3) depending on the size of complex species, and are less than those of free (hydrated) Cu(II) ions and methanediol anion (H2C(OH)O-) determined under the same conditions which are 7.0 x 10(-6) and 10 x 10(-6) cm(2) s(-1), respectively. The linear dependence of the polarographically determined diffusion coefficient values on the inverse radius of Cu(II) complex species is observed.