Journal of Applied Electrochemistry, Vol.31, No.4, 387-394, 2001
Electrochemistry of the SUCOPLATE (R) electroplating bath for the deposition of a Cu-Zn-Sn alloy - Part I: Commercial bath
The deposition of a Cu-Zn-Sn alloy from a commercial alkaline cyanide electroplating bath operated at 333 K has been investigated using voltammetric techniques and electron microscopy. It is shown that a highly reflecting alloy deposit with a composition in the range 47-51% copper, 8-12% zinc and 38-43% tin can be produced under a range of conditions. In addition, it is concluded that the rate of alloy deposition is partially limited by mass transport and partially by the kinetics of reactions in homogeneous solution.