Usability of simultaneous modulated-temperature dilatometry (MT DIL) and modulated-temperature differential thermal analysis (MT DTA) for the quantitative description of degradation kinetics of wear-resistant film adhesion to the substrate as a function of temperature are presented in this work. The reversing thermal expansion coefficient of materials as a parameter sensitive to the relaxation of mechanical thermal stresses in films tested was used for this purpose. Sample experimental results allowing the process of film degradation to be described as a function of increasing temperature are quoted. Usefulness of this method considering the films deposited at diversified process parameters is also substantiated.