Manufacturing of 3C (Computer, Communication, and Consumer Electronics) products toward weight reduction, thin-wall, and minified-size is an inescapable trend for the future 3C industries. However, the induced damage information from drop impact, including exterior housing fracture, liquid crystal display (LCD) cracking, solder-joint breaking, or interior component failure, is still derived experimentally and involves very complicated parametric analyses, such as a dynamic impact process, drop orientation, contact behavior, and large deformation during the impact instance. In the present study, numerical simulations for the drop test and bending strength were applied to a thin-wall computer dictionary (Model CD-66) housing to understand the key factors that affect the part drop test performance. The appropriate modeling that would affect simulation accuracy as well as the associated nodal degree of freedom and computer time were also investigated. A housing of CD-66 was redesigned to be 1 mm thick and structurally verified with two different plastics: polycarbonate (PC) and acrylonitrile butadiene styrene (ABS). The simplification of the PC board and LCD backlight circuit in finite element modeling (FEM) only causes about a 10% difference, while saving many modeling costs. The numerical simulations also indicate that both its bending strength and drop-impact strength were decreased only about 5%, whereas the product quality still met its strength requirement if only the top housing plate thickness was reduced while the remaining sidewall thickness was kept unchanged.