Previous Article Next Article Table of Contents Journal of the American Chemical Society, Vol.125, No.17, 4980-4981, 2003 DOI10.1021/ja034091m Export Citation Etchant solutions for the removal of Cu(0) in a supercritical CO2-based "dry" chemical mechanical planarization process for device fabrication Bessel CA, Denison GM, DeSimone JM, DeYoung J, Gross S, Schauer CK, Visintin PM [Referenced By] Please enable JavaScript to view the comments powered by Disqus.
