Microcrystalline silicon (muc-Si:H) and amorphous silicon (a-Si:H) films were deposited using a hot-wire CVD (HWCVD) system that employs a coiled filament. Process gasses, H-2 and Si2H2, could be directed into the deposition chamber via different gas inlets, either through a coiled filament for efficient dissociation or into the chamber away from the filament, but near the substrates. We found that at low deposition pressure (e.g. 20 mTorr) the structure of the films depends on the way gases are introduced into the hot-wire chamber. However, at higher pressure (e.g. 50 mTorr), Raman measurement shows similar results for films deposited with different gas inlets. (C) 2003 Elsevier Science B.V. All rights reserved.